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US 2016/0104682 A1Published application
Crack Stop Barrier and Method of Manufacturing Thereof
AssigneeInfineon Technologies AG
InventorSylvia Baumann Winter
Life of this patent
Estimating the term…
Abstract
A wafer is disclosed. The wafer comprises a plurality of chips and a plurality of kerfs. A kerf of the plurality of kerfs separates one chip from another chip. The kerf comprises a crack stop barrier.
Claims15
A semiconductor structure comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf;
- and
- a crack stop barrier located at least partially within the kerf junction.
3 more elements
A semiconductor device comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf;
- and
- a crack stop barrier located along a perimeter of the kerf junction.
3 more elements
A semiconductor structure comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- a kerf junction formed by the first kerf and the second kerf;
- and
- a crack stop barrier extending at least partially into the first kerf.
3 more elements
A semiconductor structure, comprising:
- a chip;
- a first kerf adjacent the chip and having a first main direction;
- a second kerf adjacent the chip and having a second main direction;
- and
- a crack stop barrier located in the first kerf.
2 more elements
A semiconductor device, comprising:
- a chip;
- a first scribe line adjacent the chip and having a first main direction;
- a second scribe line adjacent the chip and having a second main direction;
- a junction formed by the first scribe line and the second scribe line;
- and
- a crack stop barrier located along a side of the chip and located at least partially in the second scribe line.
3 more elements
Dependencies are inferred from the claim text.