Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die

A method of making a semiconductor device, comprising:

• providing a heat spreader frame including a first body and a second body extending perpendicularly from a first surface of a flat plate;
• disposing a semiconductor die over the flat plate of the heat spreader frame;
• depositing an encapsulant over the flat plate including a first surface of the encapsulant coplanar with a first surface of the semiconductor die;
• and
• forming a first conductive layer over a contact pad of the semiconductor die and across the first surface of the semiconductor die and encapsulant.

A semiconductor device, comprising:

• a heat spreader frame including a first body and a second body extending perpendicularly from a first surface of a flat plate;
• a semiconductor die disposed over the flat plate of the heat spreader frame including a first surface of the semiconductor die coplanar with a first surface of the first body;
• an encapsulant disposed over the flat plate including a first surface of the encapsulant coplanar with the first surface of the semiconductor die;
• and
• a conductive layer formed over a contact pad of the semiconductor die and the encapsulant.

A semiconductor device, comprising:

• a heat spreader frame including a first body and a second body extending perpendicularly from a flat plate;
• a semiconductor die disposed over the flat plate of the heat spreader frame;
• an encapsulant deposited over the flat plate;
• and
• a conductive layer formed over and contacting a first surface of the semiconductor die and a first surface of the encapsulant.