Methods of forming substrate microvias with anchor structures
AssigneeIntel Corporation
InventorsSri Ranga Sai Boyapati, Qinglei Zhang
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Abstract
Methods of forming anchor structures in package substrate microvias are described. Those methods and structures may include forming a titanium layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region. The titanium layer may then be re-sputtered using a second deposition process, wherein the titanium layer is formed in the anchor region.
Claims28
A method of forming a structure comprising:
- forming a first conductive layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region;
- and
- re-sputtering the first conductive layer using a second deposition process, wherein the first conductive layer is formed in the anchor region.
A method of forming a structure comprising:
- forming a titanium layer in a microvia of a package substrate, wherein the microvia comprises an undercut region in a bottom portion of the microvia, wherein the titanium layer does not substantially form in an anchor region of the undercut region, and wherein the titanium layer substantially forms in a line of site region of the undercut region;
- forming the titanium layer in the anchor region;
- forming a copper layer on the titanium layer, wherein the copper layer does not substantially form in the anchor region;
- and
- forming the copper layer in the anchor region.
A method of forming a structure comprising:
- forming a package substrate having a dielectric layer;
- forming an opening through the dielectric layer of the package substrate including an anchor region disposed underneath a bottom portion of dielectric layer of the package substrate;
- forming a first conductive layer disposed in an opening of a package substrate, wherein a portion of the first conductive layer is disposed in and entirely covering a bottom of the anchor region, wherein another portion of the first conductive layer is disposed in the opening abutting the dielectric layer, and wherein the portion of the first conductive layer disposed in the anchor region does not contact the another portion of the first conductive layer disposed in the opening;
- and
- forming a second conductive layer on the first conductive layer.
Dependencies are inferred from the claim text.