Self aligned via fuse
AssigneeGlobalfoundries Inc.
InventorsJunjing Bao, Samuel S. Choi, Wai-kin Li
Life of this patent
Estimating the term…
Abstract
A method including forming a first via opening in a substrate, the first via opening is self-aligned to a first trench in the substrate, forming a second via opening in the substrate, the second via opening is self-aligned to a second trench in the substrate, a portion of the second via opening overlaps a portion of the first via opening to form an overlap region, and the overlap region having a width (w) equal to or greater than a space (s) between the first trench and the second trench, and removing a portion of the substrate in the overlap region to form a bridge opening, the bridge opening is adjacent to the first and second via openings and extends between the first and second trenches.
Claims16
1-13. (canceled)
A structure comprising:
- a first metal line adjacent to a second metal line, the first and second metal lines being in the same metal level;
- a first via self-aligned to the first metal line;
- a second via self-aligned to the second metal;
- and
- a conductive bridge extending from the first metal line to the second metal line, the conductive bridge is adjacent to both the first via and the second via, and a vertical thickness of the conductive bridge is less than a vertical thickness of either the first metal line or the second metal line.
Dependencies are inferred from the claim text.