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US 2016/0104675 A1Published application
Interconnects through dielecric vias
AssigneeHewlett-Packard Development Company, L. P.
InventorsKevin Dooley, Roger McQuaid, Liam Cheevers, David Fitzpatrick, Lorraine Byrne
Life of this patent
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Abstract
A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer. An interconnect is in contact through the reflow via.
Claims15
An apparatus comprising:
- a first metal layer;
- a dielectric layer disposed on the first metal layer, wherein the dielectric layer includes a reflow via, formed by reflow of the dielectric layer;
- and
- an interconnect in contact with the first metal layer through the reflow via.
1 more element
An apparatus comprising:
- a raised feature;
- a dielectric layer disposed on the raised feature;
- a reflow via disposed in the dielectric layer at the raised feature, the reflow via formed by reflow of the dielectric layer;
- and
- an interconnect in contact with the raised feature through the reflow via.
2 more elements
A method, comprising:
- forming a dielectric layer on a first metal layer;
- reflowing the dielectric layer to form a reflow via;
- and
- forming an interconnect with the first metal layer at the reflow via.
1 more element
Dependencies are inferred from the claim text.