Back to results
US 2016/0104672 A1Published application
Low capacitance ballistic conductor signal lines
AssigneeGlobalfoundries Inc.
InventorsRoderick A. Augur, Christian Witt
Life of this patent
Estimating the term…
Abstract
A method of electrically connecting first and second conductive features includes forming a first metallization layer including the first conductive feature. A ballistic conductor line is formed above the first metallization layer. The ballistic conductor line contacts the first conductive feature proximate a first end of the ballistic conductor line. The second conductive feature is contacted proximate a second end of the ballistic conductor line.
Claims20
A method of electrically connecting first and second conductive features, the method comprising:
- forming a first metallization layer comprising said first conductive feature;
- forming a ballistic conductor line above said first metallization layer, said ballistic conductor line contacting said first conductive feature proximate a first end of said ballistic conductor line;
- and
- contacting said second conductive feature proximate a second end of said ballistic conductor line.
1 more element
A device, comprising:
- a first dielectric layer;
- a first conductive feature embedded in said first dielectric layer;
- a second dielectric layer formed above said first dielectric layer;
- a second conductive feature embedded in one of said first dielectric layer or said second dielectric layer;
- and
- a ballistic conductor line embedded in said second dielectric layer and contacting said first and second conductive features.
3 more elements
Dependencies are inferred from the claim text.