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US 2016/0104668 A1Published application
Pop joint through interposer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMirng-Ji Lii, Chien-Hsun Lee, Yu-Min Liang, Jiun Yi Wu
Life of this patent
Estimating the term…
Abstract
A package includes a package component and an interposer over and bonded to the package component. The package component includes a solder region. The interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, with the first solder region in contact with a bottom end of the conductive pipe, and a through-opening in a center region of the interposer.
Claims21
A package comprising:
- a package component comprising a first solder region;
- and
- a first interposer over and bonded to the package component, wherein the first interposer comprises:
- a core dielectric material;
- a conductive pipe penetrating through the core dielectric material, wherein the first solder region is in contact with a bottom end of the conductive pipe;
- and
- a through-opening in a center region of the first interposer.
4 more elements
A package comprising:
- a first interposer comprising:
- a core dielectric material;
- a through-opening in a center region of the first interposer;
- a plurality of conductive pipes penetrating through the core dielectric material, wherein the plurality of conductive pipes encircles the through-opening;
- and
- a second interposer over the first interposer, the second interposer comprising:
- a first plurality of solder regions on a bottom side of the second interposer, each bonded to one of the plurality of conductive pipes;
- and
- a second plurality of solder regions on a top side of the second interposer.
6 more elements
15-20. (canceled)
A package comprising:
- a first interposer comprising:
- a plurality of conductive pipes;
- and
- an opening encircled by the plurality of conductive pipes;
- a first plurality of solder regions extending into spaces in the plurality of conductive pipes, wherein the first plurality of solder regions comprises portions over the first interposer;
- a second plurality of solder regions extending into the spaces in the plurality of conductive pipes, wherein the second plurality of solder regions comprises portions underlying the first interposer;
- and
- a device die extending into the opening of the first interposer.
5 more elements
Dependencies are inferred from the claim text.