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US 2016/0104667 A1Published application
Substrate for semiconductor package and process for manufacturing
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTien-Szu Chen, Chun-Che Lee, Sheng-Ming Wang
Life of this patent
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Abstract
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.
Claims20
A semiconductor package, comprising:
- a package substrate comprising:
- a dielectric layer;
- a first circuit layer disposed on or in the dielectric layer;
- and
- a plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar;
- a die;
- and
- a plurality of solder balls disposed on the die, wherein each of the solder balls is bonded to each of the pillars and kept at the recess portion.
5 more elements
A semiconductor package, comprising:
- a dielectric layer;
- a first circuit layer disposed on or in the dielectric layer;
- a plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar;
- an insulation material enclosing the pillars;
- a die attached to the pillars;
- and
- a molding compound encapsulating the die.
4 more elements
A process for making a package substrate, comprising:
- (a) providing a package substrate, wherein the package substrate includes a dielectric layer and a first circuit layer disposed on or in the dielectric layer;
- (b) forming a photoresist pattern adjacent to the first circuit layer, wherein the photoresist pattern has a plurality of openings;
- (c) forming a plurality of pillars in the openings of the photoresist pattern;
- and
- (d) removing a part of each of the top ends of the pillar so that each of the pillars has a recess portion in the top end of the pillar.
2 more elements
Dependencies are inferred from the claim text.