Power Converter Package with Integrated Output Inductor
AssigneeInternational Rectifier Corporation
InventorsEung San Cho, Dan Clavette
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AssigneeInternational Rectifier Corporation
InventorsEung San Cho, Dan Clavette
Estimating the term…
In one implementation, a semiconductor package includes a first patterned conductive carrier including partially etched segments. The semiconductor package also includes a control FET having a control drain attached to a first partially etched segment of the first patterned conductive carrier. In addition, the semiconductor package includes a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of the first patterned conductive carrier. The semiconductor package further includes a second patterned conductive carrier having a switch node segment situated over a control source of the control FET and over a sync drain of the sync FET, as well as an inductor coupled between the switch node segment and an output segment of the second patterned conductive carrier.
A semiconductor package comprising:
A method for fabricating a semiconductor package, said method comprising:
Dependencies are inferred from the claim text.