Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

A semiconductor device, comprising:

• a base member;
• and
• a first semiconductor chip mounted over the base member, the first semiconductor chip including a plurality of circuits and a plurality of pads,
• wherein the circuits include a first circuit, a second circuit, and a third circuit, which is arranged between the first circuit and the second circuit,
• wherein the first, second and third circuits are arranged along a first side of the first semiconductor chip,
• wherein, in a plan view, the plurality of pads are spaced apart from the first, second and third circuits,
• wherein the plurality of pads include a plurality of first pads arranged at a first pitch, and a plurality of second pads arranged at the first pitch,
• wherein in the plan view, the plurality of first pads and the plurality of second pads are arranged along the first side of the first semiconductor chip,
• wherein a distance between a first pad group comprised of the plurality of first pads and a second pad group comprised of the plurality of second pads is greater than the first pitch, and
• wherein, in the plan view, a part of the third circuit is located between the first pad group and the second pad group,
• wherein the first circuit is a digital interface circuit,
• wherein the second circuit is an analog interface circuit, and
• wherein the third circuit is a circuit other than the digital interface circuit and the analog interface circuit.