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US 2016/0104663 A1Published application
Patterned lead frame
AssigneeStmicroelectronics Pte Ltd
InventorWing Shenq WONG
Life of this patent
Estimating the term…
Abstract
A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.
Claims29
A device, comprising:
- a lead frame having a central area, including:
- a plurality of wire bond leads at a periphery of the lead frame;
- a plurality of concentric support frames positioned centrally with respect to the plurality of wire bond leads, the central area being free from the plurality of support frames;
- and
- a plurality of tie bars fixed to and extending from the plurality of support frames towards the periphery;
- and
- a die positioned on the lead frame, the die overlapping the central area and at least one of the plurality of concentric support frames.
4 more elements
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A device, comprising:
- a lead frame having a central area that includes an opening, the lead frame including:
- a first, second, third, and fourth tie bar;
- a first ring positioned around the opening;
- and
- a second ring spaced from the first ring by a first gap, the second ring being separated from the central area by the first ring, the second ring coupled to the first, second, third, and fourth tie bars;
- and
- a die positioned on the lead frame, the die overlapping the central area and the first ring.
4 more elements
An integrated circuit package, comprising:
- a lead frame having a center, including:
- a plurality of concentric components around the center of the lead frame;
- a plurality of tie bars physically coupled to the plurality of concentric components;
- and
- a die positioned on the lead frame and having a first surface with a first area, a surface area of the lead frame that is facing the first surface of the die being less than the first area.
2 more elements
Dependencies are inferred from the claim text.