Method and system for extending die size and packaged semiconductor devices incorporating the same

A packaged semiconductor device, comprising:

• a die flag and a plurality of lead frame fingers, a proximate end of each lead frame finger spaced apart from the die flag;
• a spacer mechanically and electrically coupled to a first surface of the die flag at a first surface of the spacer, the spacer comprising at least one groove with an insulative material coupled thereto, the insulative material located between the spacer and at least one of the plurality of lead frame fingers;
• a die mechanically and electrically coupled to a second surface of the spacer at a first surface of the die;
• at least one electrical connector electrically coupling at least one electrical contact on a second surface of the die with at least one of the lead frame fingers;
• and
• a molding compound encapsulating the die, the spacer, at least a portion of the at least one electrical connector, at least a portion of the die flag, and at least a portion of each of the lead frame fingers;
• wherein a width of the spacer along the second surface of the spacer is greater than a width of the die flag along the first surface of the die flag.