Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device

A thermally conductive sheet, comprising:

• a binder;
• carbon fibers;
• and
• an inorganic filler,
• wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device,
• wherein the carbon fibers have an average fiber length of 50 μm to 250 μm,
• wherein an amount of the carbon fibers in the thermally conductive sheet is 28% by volume to 40% by volume,
• wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and
• wherein the thermally conductive sheet has an average thickness of 500 μm or less.

A thermally conductive sheet, comprising:

• a binder;
• carbon fibers;
• and
• an inorganic filler,
• wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device,
• wherein the carbon fibers have an average fiber length of 50 μm to 250 μm,
• wherein an amount of the carbon fibers in the thermally conductive sheet is 20% by volume to 40% by volume,
• wherein an amount of the inorganic filler in the thermally conductive sheet is 30% by volume to 55% by volume,
• wherein the inorganic filler contains alumina and aluminum nitride,
• wherein the alumina has an average particle diameter of 4 μm to 5 μm,
• wherein the aluminium nitride has an average particle diameter of 0.5 μm to 1.5 μm,
• wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and
• wherein the thermally conductive sheet has an average thickness of 400 μm or less.