Electronic device with redistribution layer and stiffeners and related methods
AssigneeStmicroelectronics Pte Ltd
InventorJing-En LUAN
Life of this patent
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Abstract
An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.
Claims22
An electronic device comprising:
- an integrated circuit (IC);
- a plurality of electrically conductive connectors coupled to said IC;
- a heat sink layer adjacent said IC and opposite said plurality of electrically conductive connectors;
- an encapsulation material surrounding said IC and said plurality of electrically conductive connectors;
- a redistribution layer having a plurality of electrically conductive traces coupled to said plurality of electrically conductive connectors;
- a stiffener between said heat sink layer and said redistribution layer;
- and
- a fan-out component between said heat sink layer and said redistribution layer and being in said encapsulation material.
An electronic device comprising:
- an integrated circuit (IC);
- a plurality of electrically conductive connectors coupled to said IC;
- a heat sink layer adjacent said IC and opposite said plurality of electrically conductive connectors;
- a thermal interface layer between said heat sink layer and said IC;
- an encapsulation material surrounding said IC and said plurality of electrically conductive connectors;
- a redistribution layer having a plurality of electrically conductive traces coupled to said plurality of electrically conductive connectors;
- a stiffener between said heat sink layer and said redistribution layer and having an inner surface adjacent said encapsulation material and an outer surface defining an external surface of the electronic device;
- and
- a fan-out component between said heat sink layer and said redistribution layer and being in said encapsulation material.
A method of making an electronic device comprising:
- forming a plurality of electrically conductive connectors coupled to an integrated circuit (IC);
- positioning a heat sink layer adjacent the IC and opposite the plurality of electrically conductive connectors;
- forming an encapsulation material surrounding the IC and the plurality of electrically conductive connectors;
- positioning a redistribution layer having a plurality of electrically conductive traces coupled to the plurality of electrically conductive connectors;
- positioning a stiffener between the heat sink layer and the redistribution layer;
- and
- positioning a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.
Dependencies are inferred from the claim text.