Semiconductor device and semiconductor module
AssigneeMitsubishi Electric Corporation
InventorsKoichi USHIJIMA, Khalid Hassan HUSSEIN, Shoji SAITO
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Abstract
A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.
Claims13
A semiconductor device comprising:
- a semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof;
- a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole;
- and
- a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw.
(canceled)
A semiconductor device comprising:
- a semiconductor module having a plurality of cooling fins;
- and
- a cooling jacket having a cooling medium passage in which the plurality of cooling fins are housed,
- wherein a snap-fitting mechanism for fixing the semiconductor module to the cooling jacket is formed on the semiconductor module and the cooling jacket.
(canceled)
Dependencies are inferred from the claim text.