Package structure and method of fabricating the same
AssigneePhoenix Pioneer Technology Co., Ltd.
InventorsShih-Ping Hsu, Chih-Wen Liu, Tang-I Wu, Shu-Wei Hu
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Abstract
A method for fabricating a package structure is provided, which includes the steps of: forming a wiring layer on a carrier by electroplating; disposing at least one electronic component on the wiring layer; forming on the carrier an insulating layer that encapsulates the wiring layer and the electronic component; and removing the carrier. With the single wiring layer having one surface electrically connected the at least one electronic component and the other surface electrically connected to a plurality of conductive elements, the package structure has a signal transmission path that is shortened.
Claims15
A package structure, comprising:
- an insulating layer having a first surface and a second surface opposite to the first surface;
- a wiring layer formed in the insulating layer by electroplating and having a surface exposed from the first surface of the insulating layer;
- and
- at least one electronic component embedded in the insulating layer and electrically connected to the wiring layer.
A method of fabricating a package structure, comprising the steps of:
- forming a wiring layer on a carrier by electroplating;
- disposing at least one electronic component on the wiring layer, and electrically connecting the electronic component to the wiring layer;
- forming on the carrier an insulating layer that encapsulates the wiring layer and the electronic component and a first surface bonded to the carrier and a second surface opposite to the first surface;
- and
- removing the carrier to expose the wiring layer and the first surface of the insulating layer.
Dependencies are inferred from the claim text.