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OwnerJohn Cleaon Mooreinventor
Estimating the term…
The invention describes the ability to conduct multiple carrier substrate removal practices simultaneously. The fixture design is slotted in a manner to hold film frame rings and has the bottom region open without interference to the passage of the released carrier substrate. Slots in the fixture are arranged on two sides at top and bottom to support the film frame, however, the distance between the slots and the area of the open region is sufficient to allow the carrier substrate to travel downwards under gravity force, once it has been released from the device wafer. The method describes a batch process whereby a fixture design supports multiple film frames with taped adhered device wafers enable exposure to a chemical medium that either acts upon the interface between the device wafer and carrier substrate or digests the carrier substrate in a manner that results in removal.
A method of separating a carrier substrate from a thinned device wafer without subsequent damage to the wafer whereby the thinned device wafer is held in a fixture while allowing the carrier substrate to separate and be removed by the effect of gravity wherein the fixture allows the simultaneous separation to occur on one or more thinned device wafers in a batch process.
Dependencies are inferred from the claim text.