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US 2016/0104632 A1Published application
Non-uniform substrate stackup
AssigneeIntel Corporation
InventorsZhichao Zhang, Tao Wu, Zhiguo Qian, Kemal Aygun
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Abstract
Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.
Claims20
A method comprising:
- forming a first trace of a substrate;
- and
- forming a second trace of the substrate, wherein the first and second traces are formed such that the first and second traces have different thicknesses.
A method comprising:
- forming a first trace on a first layer of a substrate, the first trace having a first thickness;
- forming a second trace on a second layer of the substrate, the second trace having a second thickness different from the first thickness;
- formning a first pad coupled to the first trace;
- formning a second pad coupled to the second trace;
- forming a third trace on the first layer of a substrate;
- and
- forming a fourth trace on the second layer of a substrate.
4 more elements
A method comprising:
- forming a first layer of a substrate, including forming a first trace and an additional trace of the first layer, the first trace having a first thickness, and the additional trace coupled to a pad of the substrate;
- forming a second layer of a substrate, including forming a second trace of the second layer, the second trace having a second thickness different from the first thickness;
- forming a third layer of the substrate, including forming at least one of a ground plane and a power plane layer of the third layer;
- and
- arranging a die on the substrate, such that the pad is located outside a footprint of the die.
2 more elements
Dependencies are inferred from the claim text.