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US 2016/0104629 A1Published application
Apparatus and a method for treating a substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsHONGJIN KIM, KYOUNGSEOB KIM, SUNGHO SHIN, KUNTACK LEE, KIHONG CHO
Life of this patent
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Abstract
A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
Claims10
A substrate treating method comprising:
- jetting a fluid containing an abrasive onto a substrate;
- and
- polishing the substrate using the jetted fluid.
-20 (canceled)
Dependencies are inferred from the claim text.