Excimer laser annealing apparatus and method of using the same
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorJiangbo YAO
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Abstract
An excimer laser annealing apparatus and the method thereof are disclosed. The apparatus has a substrate holder and an excimer laser unit. The substrate holder has a support surface for supporting a substrate having an amorphous silicon film and a thermoregulating module. The thermoregulating module is used to regulate the temperature on the support surface so as to control crystal orientation of amorphous silicon in the amorphous silicon film. With the thermoregulating module being added, the excimer laser annealing apparatus can control the orientation of recrystallizing of the amorphous silicon.
Claims15
A method of using an excimer laser annealing apparatus to perform annealing, wherein the excimer laser annealing apparatus includes a substrate holder and an excimer laser unit, wherein the substrate holder has a support surface for supporting a substrate having an amorphous silicon film and a thermoregulating module for regulating the temperature on the support surface so as to control crystal orientation of amorphous silicon in the amorphous silicon film, wherein the thermoregulating module is constituted by at least two light-absorbing components and at least two light-reflecting components mounted on the support surface, wherein the light-absorbing components and the light-reflecting components are embedded in the substrate holder;
- and the excimer laser unit is used to irradiate excimer laser beams onto the substrate;
- wherein the method of using an excimer laser annealing apparatus to perform annealing comprises steps of:
- providing the substrate having an amorphous silicon film on the substrate holder;
- and
- using the excimer laser unit to perform an annealing treatment on the amorphous silicon film so that the amorphous silicon of the amorphous silicon film recrystallizes along a thermoregulating direction of the thermoregulating module in a predetermined area to form a polysilicon film, wherein the predetermined area is an area of the amorphous silicon film which corresponds to the position of the thermoregulating module.
An excimer laser annealing apparatus comprising:
- a substrate holder having
- a support surface for supporting a substrate having an amorphous silicon film;
- and
- a thermoregulating module being used to regulate the temperature on the support surface so as to control crystal orientation of amorphous silicon in the amorphous silicon film;
- and
- an excimer laser unit being used to provide an excimer laser onto the substrate.
A method of using an excimer laser annealing apparatus to perform annealing, wherein the excimer laser annealing apparatus includes a substrate holder and an excimer laser unit, wherein the substrate holder has a support surface for supporting a substrate having an amorphous silicon film and a thermoregulating module for regulating the temperature of the support surface so as to control crystal orientation of amorphous silicon in the amorphous silicon film;
- and the excimer laser unit is used to provide an excimer laser onto the substrate;
- wherein the method of using an excimer laser annealing apparatus to perform annealing comprises steps of:
- providing the substrate having an amorphous silicon film on the substrate holder;
- and
- using the excimer laser unit to perform an annealing treatment on the amorphous silicon film so that the amorphous silicon of the amorphous silicon film recrystallizes along a thermoregulating direction of the thermoregulating module in a predetermined area to form a polysilicon film, wherein the predetermined area is an area of the amorphous silicon film which corresponds to the position of the thermoregulating module.
Dependencies are inferred from the claim text.