Surface sensor

A fingerprint sensor assembly comprising:

• a plurality of sensor electrodes;
• a processing unit;
• a dielectric substrate between the sensor electrodes and the processing unit;
• and
• a plurality of conductive paths associated with the plurality of sensor electrodes, each of the plurality of conductive paths including at least a portion extending through the dielectric substrate and providing an electrical connection between one of the plurality of sensor electrodes and the processing unit,
• wherein the processing unit is configured to detect a signal at each of the plurality of sensor electrodes, and
• wherein the processing unit is embedded in the dielectric substrate.

A fingerprint sensor assembly comprising:

• a plurality of sensor electrodes;
• a processing unit;
• a dielectric substrate between the sensor electrodes and the processing unit;
• and
• a plurality of conductive paths associated with the plurality of sensor electrodes, each of the plurality of conductive paths including at least a portion extending through the dielectric substrate and providing an electrical connection between one of the plurality of sensor electrodes and the processing unit;
• and
• a resin layer in contact with the dielectric substrate,
• wherein the processing unit is configured to detect a signal at each of the sensor electrodes, and
• wherein the processing unit is embedded in the resin layer.

A fingerprint sensor assembly comprising:

• a plurality of sensor electrodes;
• a processing unit;
• a dielectric substrate between the sensor electrodes and the processing unit;
• and
• a first plurality of conductive paths associated with the plurality of sensor electrodes, each of the plurality of conductive paths including at least a portion extending through the dielectric substrate and providing an electrical connection between one of the plurality of sensor electrodes and the processing unit;
• a circuit board having a first surface on which the dielectric substrate is directly or indirectly mounted, and a second surface on which the processing unit is mounted, wherein the first surface is opposite to the second surface;
• a second plurality of conductive paths extending through the circuit board and electrically connected to at least a subset of the first plurality of conductive paths extending through the dielectric substrate, the electrical connection being through direct electrical contact, indirect electrical contact through another conductor, or capacitive coupling, wherein the processing unit and the sensor electrodes are electrically connected via at least the first plurality of conductive paths and the second plurality of conductive paths, and
• wherein the processing unit is configured to detect a signal at each of the sensor electrodes.