Method For Fracturing And Forming A Pattern Using Shaped Beam Charged Particle Beam Lithography
AssigneeD2S, Inc.
InventorsAkira Fujimura, Michael Tucker
Life of this patent
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Abstract
In the field of semiconductor production using charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, where a non-circular target pattern to be formed on a surface is input. A plurality of charged particle beam shots for a multi-beam charged particle beam system is determined, where the plurality of shots will form a pattern on the surface, each charged particle beam shot being a multi-beam shot comprising a plurality of circular or nearly-circular beamlets. The pattern on the surface matches the target pattern within a predetermined tolerance. The determining is performed using a computing hardware device.
Claims21
A method for fracturing or mask data preparation, the method comprising:
- inputting a non-circular target pattern to be formed on a surface;
- determining a plurality of charged particle beam shots for a multi-beam charged particle beam system, wherein the plurality of shots will form a pattern on the surface, wherein each charged particle beam shot is a multi-beam shot comprising a plurality of circular or nearly-circular beamlets;
- wherein the pattern on the surface matches the target pattern within a predetermined tolerance;
- and
- wherein the determining is performed using a computing hardware device.
A method for manufacturing a surface using charged particle beam lithography, the method comprising:
- inputting a non-circular target pattern to be formed on the surface;
- determining a plurality of charged particle beam shots for a multi-beam charged particle beam system, wherein the plurality of shots will form a pattern on the surface, wherein each charged particle beam shot is a multi-beam shot comprising a plurality of circular or nearly-circular beamlets, and wherein the pattern on the surface matches the target pattern within a predetermined tolerance;
- and
- forming the pattern on the surface with the plurality of shots.
A system for manufacturing a surface using charged particle beam lithography, the system comprising:
- a device configured to input a non-circular target pattern to be formed on the surface;
- and
- a computation device configured to determine a plurality of charged particle beam shots that will form a pattern on the surface using a multi-beam charged particle beam system, wherein each charged particle beam shot is a multi-beam shot comprising a plurality of circular or nearly-circular beamlets, and wherein the pattern on the surface matches the target pattern within a pre-determined tolerance.
Dependencies are inferred from the claim text.