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US 2016/0103219 A1Published application
Sonic sensors and packages
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Horst Theuss
Life of this patent
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Abstract
Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
Claims14
A method comprising:
- providing an integrated sensor including a transmitter, a microelectromechanical (MEMS) microphone and driver electronics integrated in a housing having a cover comprising a piezoelectric element;
- transmitting a signal by the transmitter and the piezoelectric element;
- receiving a reflected signal by the receiver through an aperture in the cover;
- and
- determining a time of flight of the signal.
2 more elements
A semiconductor chip package comprising:
- a housing for at least one semiconductor chip, wherein at least a portion of the housing is configured as a sound generating element to generate sound waves based on electrical signals provided by an integrated circuit of the at least one semiconductor chip.
Dependencies are inferred from the claim text.