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US 2016/0103080 A1Published application
Dual-function wafer handling apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Han TSAI, Sheng-Hsiang CHUANG, Guan-Cyun LI, Yen-Ju WEI, Chiung-Min LIN, Yi-Ming CHEN
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Abstract
A dual-function wafer handling apparatus for handling a wafer includes an aligner for rotating the wafer, an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer, and an optical defect inspection unit for capturing images to analysis.
Claims20
A dual-function wafer handling apparatus for handling a wafer, the apparatus comprises:
- an aligner configured to rotate the wafer;
- an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer;
- and
- an optical defect inspection unit configure to capture images to analysis.
1 more element
A dual-function wafer handling apparatus for handling a wafer, the apparatus comprises:
- an aligner for rotating the wafer;
- an ID reader for reading an ID of the wafer;
- an image sensor for capturing an image of an edge of the wafer;
- an optical inspection processor for capturing a profile of the edge of the wafer and calculating a curvature of the profile to analysis;
- and
- a frame for arranging the ID reader and the image sensor corresponding to the edge of the wafer.
3 more elements
A method for handling a wafer, comprising:
- sorting the wafer at a station by an ID reader;
- and
- inspecting defects of the wafer at the same station by an image sensor.
Dependencies are inferred from the claim text.