Device for cutting substrate and robot
AssigneeFanuc Corporation
InventorsMasaru Oda, Yoshinori Ochiishi
Life of this patent
Estimating the term…
Abstract
Provided is a cutting device that prevents a variation of shocks or impacts applied to a substrate during a cutting operation. The cutting device includes a pressing part; a cutting part disposed so as to move with respect to the pressing part so as to contact the substrate on an opposite side of the pressing part to thereby sandwich the substrate between the cutting part and the pressing part to shear the substrate; a first force generation part for generating pressing force to press the pressing part against the substrate; and a first adjustment part for adjusting the pressing force in response to the force applied from the substrate to the pressing part when the pressing part presses the substrate with the first force generation part.
Claims12
A cutting device for cutting a substrate, comprising:
- a pressing part;
- a cutting part provided so as to be movable relative to the pressing part, the cutting part contacting the substrate from a side opposite the pressing part and sandwiching the substrate between the cutting part and the pressing part so as to shear the substrate;
- a first force generation part which generates a pressing force for pressing the pressing part against the substrate at the pressing part;
- and
- a first adjustment part which adjusts the pressing force in response to a force applied from the substrate to the pressing part when the pressing part is pressed against the substrate by the first force generation part.
Dependencies are inferred from the claim text.