Measuring device, in particular for use in the process measurement technology, comprising a cylindrical sensor tip

A measuring device, for use in the process measurement technology, including a cylindrical sensor tip which comprises a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film,

• wherein the sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder,
• wherein,
• the housing has a step-like recess which is not penetrating the housing;
• and
• the thermally conductive, electrically insulating layer is configured as a ceramic substrate that covers the recess,
• wherein the recess is disposed at the inside of the housing and is adapted to receive the solder, via which the sensor element is thermally connected to the housing, and wherein the solder distributes itself substantially uniform, i.e. with the same thickness, in the recess so that in the region of the recess between the housing wall and the ceramic substrate and hence also between the housing wall and the sensor element a defined distance is established.