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US 2016/0102413 A1Published application
Tin or tin alloy plating liquid
AssigneeRohm and Haas Electronic Materials LLC
InventorsHiroki OKADA, Li SHENGHUA, Makoto KONDO
Life of this patent
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Abstract
Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific α, β-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.
Claims8
1-7. (canceled)
8:
- A method of electroplating comprising:
- a) providing a substrate comprising vias having diameters of 10-100 μm and depths of 10-100 μm;
- b) immersing the substrate comprising vias having diameters of 10-100 μm and depths of 10-100 μm in an electroplating liquid comprising a source of tin ions and at least one α, β-unsaturated carbonyl compound having a general formula:
- wherein R1 is chosen from hydrogen, halogen, substituted or non-substituted C1-C20 alkyl, C2-C20 alkenyl, and an amino group chosen from —NR5R6, wherein R5 and R6 are each independently hydrogen or substituted or non-substituted C1-C20 alkyl;
- R2-R4 are each independently chosen from hydrogen, halogen, substituted or non-substituted C1-C20 alkyl, and C2-C20 alkenyl;
- wherein substituent groups are chosen from alkyl groups having 1-9 carbon atoms, alkenyl groups, alkoxy groups, amino groups, halogen atoms, hydroxyl groups, carbonyl groups and cyano groups;
- and
- c) plating tin in the vias with the electroplating liquid.
5 more elements
9:
- The method of claim 8, further comprising an alloying metal ion source.
10:
- The method of claim 9, wherein alloying metals are chosen from silver, copper, gold, platinum, zinc, nickel, bismuth, indium, thallium, antimony, palladium, rhodium, iridium and lead.
11:
- The method of claim 8, wherein the α, β-unsaturated carbonyl compound is in amounts of 0.0001 g/L to 10 g/L.
12:
- The method of claim 11, wherein the α, β-unsaturated carbonyl compound is in amounts of 0.0005 g/L to 5 g/L.
13:
- The method of claim 8, wherein the electroplating liquid further comprises additives chosen from an antioxidant, a complexing agent, a pH adjusting agent, a brightener and a grain refiner.
14:
- The method of claim 8, wherein the α, β-unsaturated carbonyl compounds are chosen from citral, croton aldehyde, 4-hexene-3-one, acrylamide, isopropyl acrylamide, di-methyl acrylamide, sorbic aldehyde, tiglin aldehyde, crotonyl chloride, butenoyl chloride and 4-chloro-2-butenal.