Vacuum pre-wetting apparatus and methods
AssigneeApplied Materials, Inc.
InventorsRobert B. Moore, Vincent Steffan Francischetti
Life of this patent
Estimating the term…
Abstract
A processing apparatus may include a down-facing substrate processing chamber fixed at acute angle to horizontal. A chuck plate on a platform may pivot from an open position wherein the platform is at an acute angle to the processing chamber, to a parallel position wherein the platform is parallel to the processing chamber. The chuck plate may then be moved linearly into sealing engagement with the processing chamber. A chuck holder may be provided on the platform to hold the chuck in place.
Claims15
Processing apparatus, comprising:
- a base;
- a chamber plate at a fixed acute angle to the base, with the chamber plate including a substrate processing chamber;
- a chuck plate on a platform pivotal from an open position wherein the platform is at an acute angle to the chamber plate, to a closed position wherein the platform is parallel to the chamber plate;
- a chuck holder on the platform movable from a load/unload position wherein a wafer chuck may be loaded onto or removed from the platform, to a hold position wherein the chuck is secured onto the platform.
A vacuum pre-wet apparatus, comprising
- a base;
- a chamber plate having a substrate processing chamber oriented at a fixed angle relative to the base;
- a chuck plate on a platform assembly;
- a pivot actuator connected to the platform assembly for pivoting the platform assembly from a first position where the chuck plate is at an acute angle to the processing chamber, to a second position wherein the chuck plate is parallel to the processing chamber;
- and
- at least one lift actuator attached to the platform assembly and to the chamber plate, for moving the chuck plate linearly into sealing engagement with the chamber plate.
A method for pre-wetting a wafer in a chuck, comprising:
- securing the chuck onto a horizontal chuck plate;
- pivoting the chuck plate into a parallel position wherein the chuck is parallel to a substrate processing chamber oriented at an acute angle
- moving the chuck plate linearly into engagement with the substrate processing chamber to form a seal between the chuck plate and the substrate processing chamber;
- reducing the pressure in the substrate processing chamber to below ambient;
- introducing de-gasified de-ionized water into the chamber from a lower end of the chamber, until the wafer is covered with water, while maintaining the chamber at below ambient pressure;
- venting the chamber to ambient pressure;
- draining the water out of the chamber;
- moving the chuck plate linearly away from the substrate processing chamber;
- and
- pivoting the chuck plate back to horizontal.
Dependencies are inferred from the claim text.