Hydrophobic inorganic particles, resin composition for heat dissipation member, and electronic component device

Hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound,

• wherein the organic compounds are one or more kinds selected from compounds included in Groups (i) to (v) below:
• (i) amine and carboxylic acid which are monobasic acid having 8 or more carbon atoms (in the case of carboxylic acid, carbons in the carboxyl group are excluded) and having a straight chain or a branched chain;
• (ii) amine and carboxylic acid which are dibasic acid having 6 or more carbon atoms (in the case of carboxylic acid, carbons in the carboxyl group are excluded) and having a straight chain or a branched chain;
• (iii) amine and carboxylic acid which are monobasic acid having a straight chain or a branched chain, including a carbon-carbon double bond;
• (iv) amine and carboxylic acid which are monobasic acid or dibasic acid, having an aromatic ring;
• and
• (v) alcohol or phenol compound having 6 or more carbon atoms,
• where the compounds included in Groups (iii) and (iv) are not included in Group (i), and the compounds included in Group (iv) are not included in Group (ii).