Method of improving getter efficiency by increasing superficial area

A MEMs (microelectromechanical system) package, comprising:

• a substrate comprising a cavity located within an upper surface of the substrate, wherein the substrate has substantially smooth interior surfaces lining the cavity;
• a layer of corrugated material arranged onto the substantially smooth interior surfaces of the cavity, wherein the layer of corrugated material forms roughened interior surfaces within the cavity;
• and
• a getter layer arranged onto the roughened interior surfaces within the cavity.

A semiconductor device, comprising:

• a semiconductor substrate comprising a cavity located within an upper surface of the semiconductor substrate, wherein the semiconductor substrate has roughened interior surfaces lining the cavity;
• a getter layer covering the roughened interior surfaces of the semiconductor substrate;
• and
• wherein the getter layer comprises a material that is different than the semiconductor substrate and that contacts the roughened interior surfaces of the semiconductor substrate along a non-planar interface.