Piezoelectric device, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of piezoelectric device

A manufacturing method of a piezoelectric device, which includes a first area in which silicon oxide, a second supporting layer, a first electrode layer, a piezoelectric layer containing lead, and a second electrode layer are sequentially stacked, a second area in which the silicon oxide, the second supporting layer, the piezoelectric layer, and the second electrode layer are sequentially stacked, and a third area in which the silicon oxide and the second electrode layer are sequentially stacked, the method comprising:

• after forming the silicon oxide, the second supporting layer, and the piezoelectric layer, removing the second supporting layer and the piezoelectric layer formed in the third area;
• performing a heat process in a state in which the silicon oxide formed in the third area is separated from the piezoelectric layer;
• diffusing the lead in the piezoelectric layer to the silicon oxide formed in the third area;
• and
• adding the lead to the second electrode layer of the silicon oxide side in the third area as impurities.

A piezoelectric device comprising:

• a supporting body in which a second supporting layer is stacked on a first supporting layer;
• and
• a piezoelectric element in which a first electrode layer, a piezoelectric layer, and a second electrode layer are sequentially stacked on the second supporting layer,
• wherein the first electrode layer is formed on a first area where bending deformation of the supporting body is allowed, and the second electrode layer is successively formed from the first area to a second area in the outside of the first area, and
• wherein in the first area, the piezoelectric layer is formed up to the outside of the first electrode layer, and the second electrode layer is stacked on the first supporting layer after removing the second supporting layer in an area in the outside of the piezoelectric layer.