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US 2016/0101609 A1Published application
Methods for Bonding Structures With Adhesive in Electronic Devices
AssigneeApple Inc.
InventorsCyrus Y. Liu, Der-Song Lin, Kuo-Hua Sung
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AssigneeApple Inc.
InventorsCyrus Y. Liu, Der-Song Lin, Kuo-Hua Sung
Estimating the term…
An electronic device may have display layers and other structures. A layer of liquid adhesive may be patterned onto a structure. The liquid adhesive may be pre-cured to increase the viscosity of the liquid adhesive and to partially shrink the liquid adhesive. The structure to which the liquid adhesive has been applied may be laminated to another structure. During lamination, the pre-cured liquid adhesive may be compressed between the structures that are being laminated. The adhesive may then be fully cured to bond the structures together. The thickening of the liquid adhesive during pre-curing helps control the spread of the adhesive. The shrinking of the liquid adhesive helps prevent stresses from developing that could lead to visible stress-induced artifacts following curing.
A method, comprising:
A method for forming a display, comprising:
A method, comprising:
Dependencies are inferred from the claim text.