Methods of forming structures for downhole applications, and related downhole structures and assemblies
AssigneeBaker Hughes Incorporated
InventorsJeffrey R. Potts, Sayantan Roy, Michael H. Johnson, Anil K. Sadana
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Abstract
A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.
Claims20
A method of forming a structure for a downhole application, comprising forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate.
A downhole structure comprising:
- a first substrate;
- a second substrate;
- and
- an interfacial material between the first substrate and the second substrate, the interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.
A downhole assembly, comprising:
- at least one downhole structure comprising:
- a first substrate;
- a second substrate;
- and
- an interfacial material between the first substrate and the second substrate, the interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.
Dependencies are inferred from the claim text.