Composite substrate and method for manufacturing same
AssigneeKYOCERA Corporation
InventorsHideki MATSUSHITA, Masanobu KITADA, Tetsuhiro OSAKI
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AssigneeKYOCERA Corporation
InventorsHideki MATSUSHITA, Masanobu KITADA, Tetsuhiro OSAKI
Estimating the term…
A composite substrate comprising a monocrystalline support substrate made of an insulating material and a monocrystalline semiconductor part disposed as a layer on the upper surface of the support substrate. An interface region having a thickness of 5 nm from the bonding interface between the support substrate and the semiconductor part towards the semiconductor part side includes a metal comprising: a metal element excluding the materials constituting the main components of the support substrate and the semiconductor part; and an inert element selected from the group consisting of Ar, Ne, Xe, and Kr[[Xr]]. The number of atoms per unit area of the inert element is greater than that of the metal and smaller than that of the element constituting the semiconductor part.
A composite substrate comprising:
A method for manufacturing a composite substrate comprising the steps of:
Dependencies are inferred from the claim text.