Diamond Abrasive Recovery Method
AssigneeKonica Minolta, Inc.
InventorsYuuki Nagai, Akihiro Maezawa, Chie Inui
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Abstract
A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.
Claims4
A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon, the method comprising:
- (1) recovering polishing material slurry including the used diamond abrasive;
- (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium;
- and
- (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.
Dependencies are inferred from the claim text.