Buffing apparatus and substrate processing apparatus
AssigneeEbara Corporation
InventorsKuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO
Life of this patent
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Abstract
A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.
Claims12
A buffing apparatus for buffing a substrate, the buffing apparatus comprising:
- a buff table for holding the substrate, the buff table being rotatable;
- a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head;
- and
- an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.
A method for buffing a substrate with a buffing apparatus, the method comprising:
- a step of disposing the substrate on a buff table for holding and rotating the substrate;
- a step of supplying the process liquid from an external nozzle in a state in which the buff table is rotated before bringing a buff pad attached to a buff head, in which an internal supply line for supplying process liquid for the buffing to the substrate is formed, into contact with the substrate;
- and
- a step of performing the buffing while supplying the process liquid through the internal supply line after the step of supplying the process liquid from the external nozzle.
A method for buffing a substrate with a buffing apparatus, the method comprising:
- a step of disposing a the substrate on a buff table for holding and rotating the substrate;
- a step of supplying the process liquid from an external nozzle in a state in which rotation of the buff table is stopped before bringing a buff pad attached to a buff head, in which an internal supply line for supplying process liquid for the buffing to the substrate is formed, into contact with the substrate;
- a step of bringing the buff pad into contact with the substrate and starting the rotation of the buff table after the supply of the process liquid from the external nozzle is started;
- and
- a step of performing the buffing while supplying the process liquid through the internal supply line after the step of starting the rotation of the buff table.
Dependencies are inferred from the claim text.