Microfluidic delivery system and method
AssigneesSTMicroelectronics S.r.l., STMicroelectronics International N.V.
InventorsSimon Dodd, Joseph Edward Scheffelin, Dave S. Hunt, Timothy James HOEKSTRA, Faiz SHERMAN, Stephan Gary Bush
Life of this patent
Estimating the term…
Abstract
One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.
Claims29
A microfluidic delivery system, comprising:
- a first chamber facing a fluid transport member, the first chamber being configured to receive fluid from an end of the fluid transport member;
- a printed circuit board having a through opening in fluid communication with the first chamber;
- a semiconductor die mounted on the printed circuit board covering the through opening, the semiconductor die including:
- a plurality of second chambers in fluid communication with the first chamber and configured to receive the fluid from the first chamber through the through opening in the printed circuit board;
- a plurality of nozzles in fluid communication with the plurality of second chambers;
- and
- a plurality of ejection elements associated with the plurality of second chambers, each of the plurality of ejection elements being configured to cause the fluid in the plurality of second chambers to be expelled through the plurality of nozzles.
A microfluidic delivery system, comprising:
- a lid configured to be secured to a reservoir;
- a first through hole in the lid, a first end of the through hole in fluid communication with the reservoir and configured to receive fluid from an end of a fluid transport member located in the reservoir;
- a second through hole in the lid, the second through hole being in fluid communication with air in the reservoir;
- and
- a microfluidic delivery member coupled to the lid, the microfluidic delivery member including:
- a plurality of second chambers in fluid communication with the first through hole in the lid;
- a plurality of nozzles in fluid communication with the plurality of second chambers;
- and
- a plurality of ejection elements associated with the plurality of second chambers, each of the ejection elements being configured to cause the fluid in the plurality of second chambers to be expelled through the plurality of nozzles.
A lid for a microfluidic refill cartridge, the lid comprising:
- a planar portion having first and second surfaces;
- a first through hole in the planar portion, the first through hole configured to be in fluid communication with a fluid in a reservoir;
- a second through hole in the planar portion, the second through hole configured to be in communication with air in the reservoir when the lid is coupled to the reservoir;
- a circuit board located on the planar portion and having a third through hole that faces the first through hole in the planar portion;
- and
- a semiconductor die coupled to the circuit board covering the third through hole, the semiconductor die including a nozzle plate having a plurality of nozzles that are configured to eject fluid received from the reservoir through the third through hole of the circuit board.
A lid for a microfluidic refill cartridge, the lid comprising:
- a planar portion and a side portion extending from the planar portion;
- a first through hole in the planar portion, the first through hole configured to be in fluid communication with a fluid in a reservoir;
- a second through hole in the side portion, the second through hole configured to be in communication with air in the reservoir when the lid is coupled to the reservoir;
- a circuit board located on the planar portion and having a third through hole that faces the first through hole in the planar portion;
- and
- a semiconductor die coupled to the circuit board covering the third through hole, the semiconductor die including a nozzle plate having a plurality of nozzles that are configured to eject fluid received from the reservoir through the third through hole of the circuit board.
Dependencies are inferred from the claim text.