Chemically amplified negative resist composition, photo-curable dry film, making method, patterning process, and electric/electronic part-protecting film

A chemically amplified negative resist composition comprising

• (A) a silicone structure-bearing polymer comprising recurring units of the general formula (1) and having a weight average molecular weight of 3,000 to 500,000,
• wherein R1 to R4 are each independently a monovalent C1-C8 hydrocarbon group, m is an integer of 1 to 100, a, b, c and d are each independently 0 or a positive number, a+b>0, and a+b+c+d=1, X is a divalent organic group having the general formula (2):
• wherein W is a divalent organic group selected from the following:
• n is 0 or 1, R5 and R6 are each independently a C1-C4 alkyl or alkoxy group, k is independently 0, 1 or 2, Y is a divalent organic group having the general formula (3):
• wherein V is a divalent organic group selected from the following:
• p is 0 or 1, R7 and R8 are each independently a C1-C4 alkyl or alkoxy group, h is independently 0, 1 or 2,
• (B) at least one compound selected from polyhydric phenols having at least three hydroxyl groups,
• (C) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of wavelength 190 to 500 nm, and
• (D) a solvent.