Semiconductor package

A semiconductor package comprising:

• a data pad configured to receive data during probe testing;
• a first probe test buffer configured to buffer data received from the data pad in response to an internal power-supply voltage;
• a first probe test driver configured to drive data received from the first probe test buffer in response to the internal power-supply voltage;
• a bump circuit unit configured to buffer a signal received from a bump pad;
• and
• a power-source selection unit configured to change a level of the internal power-supply voltage applied to the first probe test buffer and the first probe test driver in response to a test-mode signal.

A semiconductor package comprising:

• a probe circuit unit configured to receive data and an address through pads;
• a bump circuit unit coupled with the probe circuit unit and configured to receive data and an address through bump pads;
• a power source selection unit configured to provide a first power-supply voltage to the probe circuit unit and a second power-supply voltage to the bump circuit unit,
• wherein the first power-supply voltage is different from the second power-supply voltage in response to a test-mode signal received by the power source selection unit.