Semiconductor device and method for testing the same
AssigneeIndustry-Aca-Demic Cooperation Foundation, Yonsei University
InventorsSungho KANG, Jaeseok PARK
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Abstract
A semiconductor device and a method for testing the same are provided. The semiconductor device includes a plurality of semiconductor dies staked, a plurality of through-electrodes disposed between the semiconductor dies, a first calculation unit calculating a first output value from input signals inputted into the through-electrodes by a logical operation, a second calculation unit calculating a second output value from output signals outputted from the through-electrodes by a logical operation, and a comparator comparing the first output value with the second output value.
Claims20
A semiconductor device comprising:
- a plurality of semiconductor dies staked;
- a plurality of through-electrodes disposed between the semiconductor dies;
- a first calculation unit calculating a first output value from input signals inputted into the through-electrodes by a logical operation;
- a second calculation unit calculating a second output value from output signals outputted from the through-electrodes by a logical operation;
- and
- a comparator comparing the first output value with the second output value.
A three-dimensional semiconductor device comprising:
- a plurality of semiconductor dies stacked;
- and
- a plurality of signal transmission units disposed between the semiconductor dies,
- wherein each of the signal transmission units comprising:
- a plurality of through-electrodes disposed between the semiconductor dies, the plurality of through-electrodes comprising at least one redundancy through-electrode;
- a first calculation unit calculating a first output value from input signals, inputted to the through-electrodes, by a logical operation;
- a second calculation unit calculating a second output value from output signals, outputted from the through-electrodes, by the same logical operation as the first calculation unit;
- and
- a comparator comparing the first output value transmitted through first redundancy through-electrode among the at least one redundancy through-electrode with the second output value transmitted from the second calculation unit to output a comparison value.
A semiconductor device comprising:
- a plurality of semiconductor dies stacked;
- a plurality of through-electrodes disposed between the semiconductor dies;
- a plurality of first calculation units each calculating a first output value from at least a portion of input signals inputted to the through-electrodes by a logical operation;
- a plurality of second calculation units, each of the second calculation units calculating a second output value from at least a portion of output signals outputted from the through-electrodes by the same logical operation as the first calculation unit corresponding to each of the second calculation units;
- and
- a plurality of comparators outputting comparison values by comparing the first output value of each of the first calculation units with the second output value of each of the second calculation units corresponding to each of the first calculation units, to output comparison values.
Dependencies are inferred from the claim text.