Semiconductor device and multi-semiconductor package including the same
AssigneeSK hynix Inc.
InventorDae-Suk KIM
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a built-in self-test controller suitable for generating a test command and test data, and generating a test result signal in response to test result data, in a built-in self-test mode, an internal circuit suitable for performing a test operation in response to the test command and the test data and generating the test result data as a result of the test operation, and a signal transfer controller suitable for outputting the test command, the test data, and the test result signal through a set probe pad and a set bump pad in the built-in self-test mode.
Claims20
A semiconductor device, comprising:
- a built-in self-test controller suitable for generating a test command and test data, and generating a test result signal in response to test result data, in a built-in self-test mode;
- an internal circuit suitable for performing a test operation in response to the test command and the test data and generating the test result data as a result of the test operation;
- and
- a signal transfer controller suitable for outputting the test command, the test data, and the test result signal through a set probe pad and a set bump pad in the built-in self-test mode.
A multi-semiconductor package, comprising:
- a first semiconductor device suitable for receiving a test command and test data through a first bump pad, performing a first test operation to produce first test result data as a result of the first test operation, and outputting the first test result data through the first bump pad, in a built-in self-test mode;
- and
- a second semiconductor device suitable for generating the test command and the test data from within, performing a second test operation to generate second test result data as a result of the second test operation, generating a second test result signal corresponding to the second test result data and a first test result signal corresponding to the first test result data which is inputted through a second bump pad, and outputting the test command, the test data, the first test result signal, and the second test result signal through the second bump pad and a set probe pad, in the built-in self-test mode.
A multi-semiconductor package, comprising:
- a plurality of semiconductor devices each suitable for performing a test operation in response to a test command and test data and generating test result data as a result of the test operation, in a built-in self-test mode,
- wherein one of the semiconductor devices includes a built-in self-test controller suitable for generating the test command and the test data, and generating a test result signal corresponding to the test result data, and outputs the test command, the test data, and the test result signal through a probe pad thereof, in the built-in self-test mode.
Dependencies are inferred from the claim text.