Plating method
AssigneeEbara Corporation
InventorsShingo YASUDA, Akira OWATARI
Life of this patent
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Abstract
A method of plating a substrate, such as a wafer, by applying a voltage between the substrate and an anode is disclosed. The plating method includes: preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess; placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive; applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate; and shutting off a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a diode disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied.
Claims10
A method for plating a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate, comprising:
- preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;
- placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;
- applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate;
- and
- shutting off a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a diode disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied.
A method for plating a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate, comprising:
- preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;
- placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;
- applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate;
- and
- applying a forward voltage, which is lower than the predetermined plating voltage, between the substrate and the insoluble anode when the predetermined plating voltage is not applied, thereby decreasing a reverse electric current which flows from the insoluble anode to the substrate via the plating power source.
A method for plating of a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate, comprising:
- preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;
- placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;
- applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate;
- controlling a concentration of the additive in the copper sulfate plating solution based on a change in the concentration of the additive in the copper sulfate plating solution by supplying an additive into the copper sulfate plating solution;
- and
- shutting off an electrical connection between the insoluble anode and the substrate when the predetermined plating voltage is not applied.
A method for plating a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate, comprising:
- preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;
- placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;
- applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate;
- controlling a concentration of the additive in the copper sulfate plating solution based on a change in the concentration of the additive in the copper sulfate plating solution by supplying an additive into the copper sulfate plating solution;
- and
- decreasing a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, by a resistor disposed between the insoluble anode and the substrate when the predetermined plating voltage is not applied.
A method for plating a substrate while preventing a generation of an electrolyte component which inhibits bottom-up plating of the substrate, comprising:
- preparing a substrate having a recess formed in a surface thereof, a conductive layer being formed in at least a part of the recess;
- placing an insoluble anode and the substrate in contact with a copper sulfate plating solution containing an additive;
- applying a predetermined plating voltage between the substrate and the insoluble anode by a plating power source to plate the substrate;
- measuring a reverse electric current, which flows from the insoluble anode to the substrate via the plating power source, when the predetermined plating voltage is not applied;
- and
- replacing at least a part of the copper sulfate plating solution with a new plating solution if a cumulative value of the measured reverse electric current reaches a predetermined threshold value.
Dependencies are inferred from the claim text.