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US 2016/0097128 A1Published application
Method of forming a conductive image using high speed electroless plating
AssigneeEarthone Circuit Technologies Corporation
InventorWilliam Wismann
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Abstract
A method of producing a conductive image using high speed electroless plating according to the present invention preferably includes the steps of: preparing the surface of a substrate; depositing a metal coordination complex into the surface of the substrate; reducing the metal coordination complex to form an image in the surface of the substrate; depositing a protective material onto the image; electrolessly plating metal onto the image.
Claims1
A method of conductive image using high speed electroless plating comprising the steps of:
- preparing the surface of a substrate, the substrate surface having a thickness;
- depositing a metal coordination complex within the surface of the substrate;
- reducing the metal coordination complex to form a metal image in the surface of the substrate;
- depositing a protective material onto the metal image;
- and
- electrolessly plating metal onto the metal image.
3 more elements
Dependencies are inferred from the claim text.