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US 2016/0097118 A1Published application
Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
AssigneeSeagate Technology LLC
InventorsSamuel L. Tanaka, Thomas L. Greenberg, Christopher L. Platt, Joseph Tong
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Abstract
A deposition system may have at least a substrate mounted within a sealed chamber. A radio frequency energy can be supplied to an inductive source affixed to the sealed chamber with the inductive source having an inductive coil surrounding a tube. Coupling the radio frequency energy into a gas pumped into the sealed chamber creates plasma to uniformly deposit a thin layer on a surface of the substrate.
Claims20
An apparatus comprising:
- a sealed chamber housing a substrate;
- and
- means for uniformly depositing a carbon layer on opposite sides of the substrate.
A method comprising:
- mounting a substrate within a sealed chamber;
- supplying a radio frequency energy to a first inductive source affixed to the sealed chamber, the first inductive source comprising an inductive coil surrounding a tube;
- pumping a gas into the sealed chamber;
- and
- coupling the radio frequency energy into the gas with the first inductive source to form a plasma to uniformly deposit a first thin layer on a first surface of the substrate.
2 more elements
An apparatus, comprising:
- a sealed deposition chamber having a mounting feature to support a substrate therein;
- and
- an inductive source comprising a source of radio frequency (RF) energy, a tube and an inductive coil which surrounds the tube, the RF energy coupled into a gas by the inductive source to create a plasma to deposit a thin layer on the substrate.
Dependencies are inferred from the claim text.