Microscale Interface Materials for Enhancement of Electronics Performance

A thermally conductive interface material formulation comprises

• (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups of the general molecular composition (1):
• R1(R2)a(R3)bSiO(4-a-b)/2nSiR2R3R1 (1)
• wherein R1 is an alkenyl group of 2 to 8 carbons, R2 and R3 are substituted or unsubstituted monovalent hydrogencarbon groups, a and b are integers satisfying 0≦a<3, b=2-a, n is a integer of 5-200.
• (B) A branched alkenyl organopolysiloxane containing silicon-bonded alkenyl groups with the average composition formula (2):
• (R4)c(R5)dSiO(4-c-d)/2 (2)
• wherein R4 is an alkenyl group, R5 is an substituted or unsubstituted monovalent hydrogencarbon groups, c and d are integers satisfying 0<d<3, 0.001≦c/(c+d)≦0.003.
• Weight or volume ratio of compound (A) to (B) is 20:1 to 1:10.
• (C) A thermally conductive filler consisting alumina of a mean particle size of 100-5000 nm and aluminum of a mean particle size 5-100 um with a ratio of 0 to 1.
• (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups with a viscosity no greater than 800 cP at 25 C.
• Mole ratio of Si—H groups in component (D) to alkenyl groups in component (A) and (B) combined is 0.5 to 0.8.
• (E) A catalyst selected from a group of platinum compounds with an amount of platinum in a range of 1-100 ppm to the total amount of the curable silicone composition of (A), (B) and (D).
• (F) A optional inhibitor to maintain appropriate storage stability.
• (G) A alkoxysilane for enhancement of bonding strength between thermal filler component (C) and silicone resin (A), (B) and (D).