Curable silicone emulsion composition

Abstract

Provided is a curable silicone emulsion composition which has comparable curability without using an organotin compound curing catalyst, and for which the post-curing film properties thereof can obtain a comparable hardness, tensile strength, and elongation. A curable silicone emulsion composition characterized by including: (A) 100 parts by mass of an organopolysiloxane which includes a hydroxyl group bonded to at least two silicon atoms per molecule; (B) 0.01-5 parts by mass of an organohydrogenpolysiloxane which includes at least two silicon atom-bonded hydrogen atoms per molecule; (C) 1-10 parts by mass of the reaction product of an amino group-containing organoalkoxysilane and an acid anhydride; (D) 0.1-10 parts by mass of an epoxy group-containing organoalkoxysilane and/or a partial hydrolysis condensation product thereof; (E) 0.5-50 parts by mass of a colloidal silica; (F) 0.1-10 parts by mass of a bismuth compound; and (G) 50-500 parts by mass of water.

Dependencies are inferred from the claim text.