Polymer Powder, Curable Resin Composition and Cured Material Thereof
AssigneeMitsubishi Rayon Co., Ltd.
InventorsYouko Hatae, Toshihiro Kasai
Life of this patent
Estimating the term…
Abstract
A polymer powder (P) selected from a group consisting of (i) a polymer powder (P1) and (ii) a polymer powder (P2) is provided. The (i) polymer powder (P1) includes a (meth)acrylate-based polymer (A1) having a glass transition temperature of 0° C. or less, and the polymer powder has an acetone-soluble component of 5 mass % or more. The acetone-soluble component has a mass average molecular weight of 100,000 or more. The (ii) polymer powder (P2) has an acetone-soluble component of 2 mass % to 35 mass %, the acetone-soluble component has a mass average molecular weight of 100,000 or more, and has a volume average primary particle size (Dv) of 200 nm or more.
Claims15
(canceled)
A polymer powder (P1) comprising a (meth)acrylate-based polymer (A1) having the glass transition temperature of 0° C. or less, where the polymer powder has an acetone-soluble component of 5 mass % or more, where the acetone-soluble component has a mass average molecular weight of 100,000 or more.
-27. (canceled)
Dependencies are inferred from the claim text.