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US 2016/0096952 A1Published application
Polyimide resin and polyimide film produced therefrom
AssigneeKolon Industries, Inc.
InventorsHyo Jun PARK, Hak Gee JUNG, Chul Ha JU
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Abstract
Disclosed herein is a polyimide resin including a silica filler surface-treated with a fluorine-containing compound, and a polyimide film formed using the polyimide resin. The polyimide resin has improved dispersibility and heat resistance because the surface of a silica filler is fluorinated.
Claims14
A polyimide resin, comprising a silica filler surface-treated with a fluorine-containing compound.
Dependencies are inferred from the claim text.