Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
AssigneeCorning Incorporated
InventorsShawn Rachelle Markham, Windsor Pipes Thomas, III
Life of this patent
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Abstract
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.
Claims4
-18. (canceled)
A method for manufacturing non-polished glass wafers, the method comprising the steps of:
- melting batch materials and forming molten glass;
- providing a forming device for receiving the molten glass and forming a glass sheet;
- providing an apparatus comprising an enclosure disposed about the forming device, the enclosure comprising an opening below the forming body to allow a flow of molten glass descending from the forming device to pass from the enclosure, the apparatus further comprising thermal shields positioned below the forming device and spaced apart to form the opening, where the thermal shields are configured for minimizing radiative heat loss from the forming device, each thermal shield being movable relative to the flow of the molten glass, the apparatus further comprises cooling members positioned adjacent to the thermal shields, wherein the step of providing the enclosure further comprises steps of,
- controlling a pressure within the enclosure;
- controlling the cooling members;
- and
- minimizing the opening between the thermal shields to control heat transfer uniformity with respect to the glass sheet;
- drawing the glass sheet;
- separating the glass sheet into distinct glass sheets;
- and
- cutting at least one of the distinct glass sheets into a plurality of non-polished glass wafers.
Dependencies are inferred from the claim text.