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US 2016/0096729 A1Published application
Photolithography Structures and Methods
AssigneePixtronix, Inc.
InventorsJavier Villarreal, Timothy Brosnihan, Chin-Yuan Ho, Hung-Chien Lin
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Abstract
This disclosure provides systems, methods and apparatus including processes that use two layers of resist, with a layer of etch stop material in between. The two layers of resist may be etched in separate processes to form devices having vias with sidewalls that extend through both layers of resist
Claims26
A method for manufacturing a electromechancial system (EMS) device, comprising:
- depositing on a substrate, a first layer of sacrificial material, a layer of etch stop material resistant to a first etch process, and a second layer of the sacrificial material,
- etching the second layer of sacrificial material using the first etch process to form a first pattern within the second layer of sacrificial material,
- applying a mask to the patterned layer of sacrificial material that exposes at least a portion of the etch stop material, and
- etching with a second etch process the etch stop material and the first layer of sacrificial material to form a mold having features that extend through the first and second layers of sacrificial material.
1 more element
An electromechanical system (EMS) device, having
- a substrate having a first surface,
- an anchor attached to the first surface and having a sidewall with a first portion and a second portion, and a junction joining the first portion with the second portion, wherein the first portion is in contact with the first surface of the substrate and the second portion of the sidewall is spaced away from the first surface.
Dependencies are inferred from the claim text.